MIC-770H-00A2 Modular Industrial PC
MIC-770H-00A2 Modular Industrial PC

Advantech

MIC-770H-00A2 Modular Industrial PC

Part #: MIC-770H-00A2 In Stock: Ready to Ship Contact for Availability Stock: Select Options for Details
$1,075.00
MIC-770H-00A2
Weight:
8.00 LBS
pdf_1_name:
Spec Sheet
pdf_1_url:
pdfs/Advantech-MIC-770-Datasheet.pdf
hide_matrix:
True
in_stock:
False
sales_description:
Advantech, MIC-770H-00A2, Compact Fanless Modular IPC, Intel 8th/9th Gen Core i CPU socket (LGA1151), H310 chipset, DDR4 up - 64 GB, VGA plus HDMI, 1 x 2.5 in HDD/SSD plus 1 x mSATA, 4 x USB 3.1 Gen1 plus 4 x USB 2.0, 2 x GbE, 2 x RS232/422/485 (4 x
sales_description_2:
RS232 optional), FlexIO plus iDoor plus i-Module expansion, 9 - 36 VDC Power Input, IP40, -10 - 50 deg. C
parent_sku:
MIC-770H-00A2
facet_features:
Ethernet
facet_features:
X86
facet_mounting:
DIN-Rail
facet_mounting:
Desktop
facet_mounting:
Wall
facet_temperature_range:
Standard
facet_type:
Industrial Computer
Adding… The item has been added
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Details

Advantech, MIC-770H-00A2, Compact Fanless Modular IPC, Intel 8th/9th Gen Core i CPU socket (LGA1151), H310 chipset, DDR4 up - 64 GB, VGA plus HDMI, 1 x 2.5 in HDD/SSD plus 1 x mSATA, 4 x USB 3.1 Gen1 plus 4 x USB 2.0, 2 x GbE, 2 x RS232/422/485 (4 x RS232 optional), FlexIO plus iDoor plus i-Module expansion, 9 - 36 VDC Power Input, IP40, -10 - 50 deg. C

MIC-770 Compact Fanless System with 8th/9th Gen Intel® Core™ i CPU Socket (LGA 1151)

The MIC-770 is a compact, fanless modular IPC from Advantech®, featuring a socket-type 8th/9th Generation Intel® Core™ i processor (LGA1151) with Intel® Q370 or H310 chipset. It supports a wide 9~36 VDC power input and a wide operating temperature of -10~50°C (35W TDP) or -10~40°C (65W TDP) with airflow. The system provides 2 x GbE LAN, 6 x USB 3.1, 2 x RS-232/422/485, VGA and HDMI outputs, 1 x 2.5" HDD/SSD, and 1 x mSATA. It supports Advantech®'s FlexIO and iDoor technology for configurable additional display, COM port, DIO, and remote switch I/O expansion, as well as i-Modules for PCIe and GPU expansion. The system is Microsoft Azure PnP Certified and supports Intel® vPro™/AMT and TPM technologies.

Modular Expansion

The MIC-770 supports Advantech® i-Modules for PCIe slot, GPU, and storage expansion, as well as Flex I/O for additional display outputs (HDMI, DVI, DP), COM ports, GPIO, and remote power management. iDoor modules add industrial Fieldbus, serial, and wireless communication capabilities.

Features

  • Socket-type 8th/9th Gen Intel® Core™ i processor (LGA1151); Q370 or H310 chipset
  • Dual-channel DDR4 2400/2666 MHz; up to 64 GB (2 x 260-pin SO-DIMM)
  • Wide operating temperature: -10~50°C (35W CPU) or -10~40°C (65W CPU) with 0.7 m/s airflow
  • 2 x RJ45 GbE LAN
  • 2 x RS-232/422/485 (DB9); optional 4 x RS-232 via Flex I/O
  • Q370: 6 x USB 3.1 Gen 2, 2 x USB 3.1 Gen 1; H310: 4 x USB 3.1 Gen 1, 4 x USB 2.0
  • 1 x VGA (up to 1920 x 1200), 1 x HDMI (up to 4096 x 2160 @ 30 Hz)
  • 1 x 2.5" HDD/SSD, 1 x mSATA; Q370 SKU supports RAID 0/1/5/10
  • Supports Advantech® i-Modules, FlexIO, and iDoor technology
  • Intel® vPro™/AMT and TPM support
  • IP40 dust protection; desktop/wall mount installation
  • Power input 9~36 VDC; CE/FCC Class A, CCC, BSMI, CB/UL certified
  • Supports Windows 10, Windows 10 IoT, Linux OS

Documentation

Spec Sheet

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