Advantech

MIC-770V3W-00A1 Modular Industrial PC

Part #: MIC-770V3W-00A1 In Stock: Ready to Ship Contact for Availability Stock: Select Options for Details
$1,300.00
MIC-770V3W-00A1
Weight:
8.00 LBS
pdf_1_name:
Spec Sheet
pdf_1_url:
pdfs/Advantech-MIC-770-V3-Datasheet.pdf
hide_matrix:
True
in_stock:
False
sales_description:
Advantech, MIC-770V3W-00A1, Compact Fanless Modular IPC, Intel 12th/13th/14th Gen Core i CPU socket (LGA1700), R680E chipset, DDR5 up - 128 GB (ECC support on R680E), VGA plus HDMI, 1 x 2.5 in HDD/SSD plus 1 x mSATA plus 1 x NVMe M.2, 2 x USB 3.2 Gen
sales_description_2:
2 plus 6 x USB 3.2 Gen1, 2 x GbE, 2 x RS232/422/485 (4 x RS232 optional), RAID support (R680E SKU), iBMC remote OOB power management support, FlexIO plus iDoor plus i-Module expansion, 9 - 36 VDC Power Input, IP40, -20 - 60 deg. C
parent_sku:
MIC-770V3W-00A1
facet_features:
Ethernet
facet_features:
X86
facet_mounting:
DIN-Rail
facet_mounting:
Desktop
facet_mounting:
Wall
facet_temperature_range:
Standard
facet_type:
Industrial Computer
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Details

Advantech, MIC-770V3W-00A1, Compact Fanless Modular IPC, Intel 12th/13th/14th Gen Core i CPU socket (LGA1700), R680E chipset, DDR5 up - 128 GB (ECC support on R680E), VGA plus HDMI, 1 x 2.5 in HDD/SSD plus 1 x mSATA plus 1 x NVMe M.2, 2 x USB 3.2 Gen2 plus 6 x USB 3.2 Gen1, 2 x GbE, 2 x RS232/422/485 (4 x RS232 optional), RAID support (R680E SKU), iBMC remote OOB power management support, FlexIO plus iDoor plus i-Module expansion, 9 - 36 VDC Power Input, IP40, -20 - 60 deg. C

MIC-770 V3 Compact Fanless System with Intel® 12th/13th/14th Gen Core™ i Processor, Socket Type LGA1700

The MIC-770 V3 is a compact, fanless modular IPC from Advantech®, featuring socket-type 12th, 13th, or 14th Generation Intel® Core™ i processors (LGA1700) with Intel® R680E or H610E chipset and DDR5 memory. It supports a wide 9~36 VDC power input and wide operating temperature of -20~60°C (35W TDP) or -20~50°C (65W TDP) in standard configuration. The system provides 2 x GbE LAN, 2 x USB 3.2 Gen 2, 6 x USB 3.2 Gen 1, 2 x RS-232/422/485, VGA and HDMI outputs, 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2 slot. Advantech® iBMC 1.2 remote out-of-band power management is supported. An Extreme SKU with enhanced thermal dissipation extends the operating temperature range further.

Modular Expansion

The MIC-770 V3 supports Advantech® MIC-75 series i-Modules for PCIe, GPU, and storage expansion, FlexIO for additional display and COM port outputs, and iDoor technology for industrial Fieldbus and wireless connectivity.

Features

  • Socket-type 12th/13th/14th Gen Intel® Core™ i processor (LGA1700); R680E or H610E chipset
  • Dual-channel DDR5 4800 MHz; up to 128 GB (2 x 262-pin SO-DIMM); R680E SKU supports ECC
  • Wide operating temperature: -20~60°C (35W CPU) or -20~50°C (65W CPU) with 0.7 m/s airflow; Extreme SKU extends to -20~70°C
  • 2 x RJ45 GbE LAN; iBMC 1.2 remote out-of-band power management
  • 2 x RS-232/422/485 (DB9); optional 4 x RS-232 via Flex I/O
  • R680E: 2 x USB 3.2 Gen 2, 6 x USB 3.2 Gen 1; H610E: 4 x USB 3.2 Gen 1, 4 x USB 2.0
  • 1 x VGA (up to 1920 x 1200), 1 x HDMI (up to 4096 x 2160 @ 30 Hz)
  • 1 x 2.5" HDD/SSD, 1 x mSATA, 1 x NVMe M.2 M-key 2280 (PCIe Gen 4 x4, R680E SKU); R680E supports RAID 0/1/5/10
  • Supports Advantech® i-Modules, FlexIO, and iDoor technology
  • Intel® vPro™/AMT and TPM support
  • IP40 dust protection; desktop/wall mount installation
  • Power input 9~36 VDC; CE/FCC Class A, CCC, BSMI, CB/UL certified
  • Supports Windows 11, Windows 10, Windows 10 IoT, Linux OS

Documentation

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